Bonding type helps explain broad differences among material classes, although microstructure and defects are needed for quantitative behavior.

Metallic bonding uses delocalized electrons and is relatively nondirectional. This supports electrical and thermal conduction and often allows substantial plastic slip.

Ionic bonding derives from electrostatic attraction among charged ions. Ionic solids often have high cohesive energies but restricted slip because some displacements bring like charges into unfavorable proximity.

Covalent bonding localizes shared electron density in directional bonds. Strong covalent networks can be stiff and heat resistant, while directional bonding can make ordinary plastic deformation difficult.

In molecular and polymeric solids, strong covalent bonds can exist within a molecule or chain while weaker intermolecular interactions act between them. Large differences between intra- and intermolecular bonding allow chain motion, low melting or softening temperatures in some polymers, and strong rate/temperature dependence.

These are trends, not deterministic labels. A ceramic can conduct ions, a polymer can conduct electricity, a metal can be brittle, and a covalent solid can be exceptionally tough after microstructural design.

The useful reasoning pattern is therefore

$$\text{bonding}\rightarrow\text{available structures and deformation/transport mechanisms}\rightarrow\text{property trends},$$

followed by explicit treatment of defects, phases and processing for the material actually being designed.